Essential details
MOQ:50
Specification Number:THG000-1
Product Introduction
Silicon Carbide (SiC) substrates are high-performance ceramic materials renowned for exceptional thermal conductivity, superior electrical insulation, and extreme environmental resilience. As a advanced functional carrier, they outperform traditional ceramic and metal substrates in demanding scenarios.
Available in single-crystal (4H-SiC, 6H-SiC) and sintered grades, SiC substrates boast thermal conductivity ranging from 120-400 W/(m·K), withstand temperatures up to 1200°C+, and exhibit strong corrosion resistance. These traits make them ideal for high-power, high-temperature, and high-voltage applications.
Key applications span power electronics (EV inverters, renewable energy converters), semiconductor devices (SiC MOSFETs/IGBTs), aerospace components, and industrial heating equipment. They can be customized via precision cutting, drilling, polishing, or metallization to meet specific project requirements, enabling more efficient and compact system designs.
Basic Information
- What is a silicon carbide substrate?It is a high-performance ceramic substrate made from silicon carbide (SiC) material, featuring exceptional thermal conductivity, mechanical strength, and chemical stability for demanding industrial and electronic applications.
- What are the key advantages of SiC substrates over other ceramic/metal substrates?Compared to alumina (Al₂O₃) or aluminum nitride (AlN), SiC offers higher thermal conductivity and mechanical strength. It outperforms metal substrates in electrical insulation and high-temperature resistance.
- What are the main grades of SiC substrates?Common grades include 4H-SiC and 6H-SiC (polycrystalline or single-crystal) for electronic applications, and sintered SiC for structural/thermal management uses.
Application Scenarios
- Where are SiC substrates primarily used?Key applications include power electronics (EV inverters, renewable energy converters), semiconductor devices (SiC MOSFETs/IGBTs), aerospace components, high-temperature sensors, and industrial heating equipment.
- Why are SiC substrates ideal for electric vehicles (EVs)?They enable efficient heat dissipation for high-power electronics, reduce system size/weight, and improve energy conversion efficiency—extending EV range and lifespan.
- Can SiC substrates be used in extreme environments?Yes. They withstand temperatures up to 1200°C+, resist corrosion from acids/alkalis (except hydrofluoric acid), and maintain stability in high-humidity or high-vibration conditions.
Technical Specifications
- What is the thermal conductivity of SiC substrates?Typical range: 120-400 W/(m·K), with high-purity single-crystal SiC reaching 350-400 W/(m·K).
- What are the standard dimensions and thicknesses?Thickness: 0.1mm-5.0mm (standard); 0.05mm-10mm (custom). Standard sizes: 2-inch, 4-inch, 6-inch wafers (for electronics); 100×100mm to 300×300mm sheets (for industrial use).
- What is the electrical insulation performance of SiC substrates?Dielectric strength ≥ 25 kV/mm; Volume resistivity ≥ 10¹⁶ Ω·cm (at room temperature), ensuring reliable insulation in high-voltage applications.
Processing & Customization
- What processing methods are used for SiC substrates?Common processes include laser cutting (precision ±0.02mm), diamond drilling (minimum hole diameter ≥ 0.2mm), chemical mechanical polishing (CMP), and metallization (Ti/Pt/Au thin film, thick film Ag).
- Can SiC substrates be customized?Yes. Customizations include size, thickness, surface finish (polished/as-fired), metallization patterns, and hole drilling (through holes/blind holes) per CAD designs.
- What is the metallization adhesion strength for SiC substrates?Typically ≥ 15 N/mm², ensuring stable bonding with electronic components during soldering or assembly.
Installation & Usage
- How to bond SiC substrates to other components?Recommended methods: high-temperature soldering (for metallized surfaces), thermal conductive adhesive bonding, or mechanical fastening (low-stress screws/clips).
- What precautions should be taken during installation?Avoid impact or bending (SiC is brittle); match thermal expansion coefficients (CTE: 4-6 ppm/°C) with adjacent materials to prevent thermal stress; use cleanroom conditions for electronic-grade applications.
- How to maintain SiC substrates in long-term use?Avoid exposure to strong corrosives; clean with alcohol or deionized water (soft cloth only); inspect for surface cracks or metallization peeling periodically.
Quality & Reliability
- What quality tests are performed on SiC substrates?Key tests: thermal conductivity measurement, surface roughness inspection (Ra ≤ 0.1 μm for polished surfaces), flexural strength test (≥ 500 MPa), and defect detection (via microscopy/ultrasonic testing).
- What factors affect the service life of SiC substrates?Excessive mechanical stress, prolonged exposure to temperatures above 1300°C, and contact with corrosive substances are the main factors.
- Are SiC substrates compatible with standard electronic manufacturing processes?Yes. They work with soldering, wire bonding, and PCB assembly processes—compatible with existing production lines for power electronics.
